| 1. | Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding .
133节的内容既涉及热压连接工艺本身，也涉及了自动连接的传送带技术。 |
| 2. | Tape automated bonding
胶带自动接合 |
| 3. | Section 13 . 3 covers the thermocompression bonding process itself and also tape automated bonding
13 3节的内容既涉及热压连接工艺本身，也涉及了自动连接的传送带技术。 |
| 4. | Mechanical standardization of semiconductor devices - recommendations applying to tape automated bonding of integrated circuits
半导体器件机械标准化.第5部分:集成电路胶带自动粘合推荐标准 |
| 5. | Tab mechanical standardization of semiconductor devices - part 5 : recommendations applying to tape automated bonding of integrated circuits
半导体器件的机械标准化第5部分:用于集成电路载带自动焊 |
| 6. | Mechanical standardization of semiconductor devices - part 5 : recommendations applying to integrated circuit packages using tape automated bonding
半导体器件的机械标准化.第5部分:使用自动粘结装置用于集成电路包装的推荐规程 |
| 7. | Andorin optoelec technology inc . established in 1999 . as lcd module manufactory our capcapabilities are cob ( chip - on - board ) , and tab ( tape automated bonding ) . we provide extensive and complete solutions based on customer needs
安的利光电科技有限公司成立于1999年，主要产品是液晶显示模组，包括cob及tab产品系列。我们可根据客户要求提供方案，以满足客户的需要。 |
